PIC16LCR65AT-04I 查看數據表（PDF） - Microchip Technology
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PIC16LCR65AT-04I Datasheet PDF : 336 Pages
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PIC16C6X
25.13 44-Lead Plastic Surface Mount (TQFP 10x10 mm Body 1.0/0.10 mm Lead Form) (TQ)
D
D1
1.0ø (0.039ø) Ref.
Pin#1
2
Pin#1
2
E E1
11°/13°(4x)
0° Min
Θ
11°/13°(4x)
Detail B
e
Option 1 (TOP side)
Detail B
A1
A2
A
Detail A
L
1.00 Ref.
3.0ø (0.118ø) Ref.
Option 2 (TOP side)
R1 0.08 Min
R 0.08/0.20
Base Metal
Lead Finish
b
c
c1
b1
Detail A
Gage Plane
0.250
S
L
0.20
Min
L1
1.00 Ref
Detail B
Package Group: Plastic TQFP
Millimeters
Inches
Symbol
A
A1
A2
D
D1
E
E1
L
e
b
b1
c
c1
N
Θ
Min
Max
1.00
1.20
0.05
0.15
0.95
1.05
11.75
12.25
9.90
10.10
11.75
12.25
9.90
10.10
0.45
0.75
0.80 BSC
0.30
0.45
0.30
0.40
0.09
0.20
0.09
0.16
44
44
0°
7°
Notes
Min
Max
0.039
0.047
0.002
0.006
0.037
0.041
0.463
0.482
0.390
0.398
0.463
0.482
0.390
0.398
0.018
0.030
0.031 BSC
0.012
0.018
0.012
0.016
0.004
0.008
0.004
0.006
44
44
0°
7°
Notes
Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per
side. D1 and E1 dimensions including mold mismatch.
2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m
(0.003”)max.
3: This outline conforms to JEDEC MS-026.
© 1997 Microchip Technology Inc.
DS30234D-page 303
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