PIC12F1822T-I/SL 查看數據表（PDF） - Microchip Technology

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PIC12F1822T-I/SL

8/14-Pin Flash Microcontrollers with nanoWatt XLP Technology

Microchip Technology 

PIC12F/LF1822/16F/LF1823

29.6 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA Thermal Resistance Junction to Ambient TBD

C/W 8-pin PDIP package

TBD

C/W 8-pin SOIC package

TBD

C/W 8-pin DFN 3X3mm package

TBD

C/W 14-pin PDIP package

TBD

C/W 14-pin SOIC package

TBD

C/W 14-pin TSSOP 4x4mm package

TBD

C/W 16-pin QFN 4X4mm package

TH02

JC Thermal Resistance Junction to Case

TBD

C/W 8-pin PDIP package

TBD

C/W 8-pin SOIC package

TBD

C/W 8-pin DFN 3X3mm package

TBD

C/W 14-pin PDIP package

TBD

C/W 14-pin SOIC package

TBD

C/W 14-pin TSSOP 4x4mm package

TBD

C/W 16-pin QFN 4X4mm package

TH03

TJMAX Maximum Junction Temperature

150

C

TH04

TH05

PD Power Dissipation

PINTERNAL Internal Power Dissipation

—

W

PD = PINTERNAL + PI/O

—

W

PINTERNAL = IDD x VDD(1)

TH06

TH07

PI/O

PDER

I/O Power Dissipation

Derated Power

—

W

PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))

—

W

PDER = PDMAX (TJ - TA)/JA(2)

Legend: TBD = To Be Determined

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature.

3: TJ = Junction Temperature.

DS41413A-page 346

Preliminary

 2010 Microchip Technology Inc.

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