PIC16C711-04I/SP 查看數據表（PDF） - Microchip Technology

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PIC16C711-04I/SP

8-Bit CMOS Microcontrollers with A/D Converter

Microchip Technology 

PIC16C71X

Applicable Devices 710 71 711 715

11.1 DC Characteristics: PIC16C710-04 (Commercial, Industrial, Extended)

PIC16C711-04 (Commercial, Industrial, Extended)

PIC16C710-10 (Commercial, Industrial, Extended)

PIC16C711-10 (Commercial, Industrial, Extended)

PIC16C710-20 (Commercial, Industrial, Extended)

PIC16C711-20 (Commercial, Industrial, Extended)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)

-40˚C ≤ TA ≤ +85˚C (industrial)

-40˚C ≤ TA ≤ +125˚C (extended)

Param.

No.

Characteristic

Sym Min Typ† Max Units

Conditions

D001 Supply Voltage

D001A

VDD 4.0 - 6.0 V XT, RC and LP osc configuration

4.5 - 5.5 V HS osc configuration

D002* RAM Data Retention

Voltage (Note 1)

VDR - 1.5 - V

D003

VDD start voltage to

ensure internal Power-

on Reset signal

VPOR - VSS -

V See section on Power-on Reset for details

D004* VDD rise rate to ensure SVDD 0.05 -

internal Power-on Reset

signal

- V/ms See section on Power-on Reset for details

D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled

3.7 4.0 4.4 V Extended Range Only

D010 Supply Current (Note 2) IDD

- 2.7 5 mA XT, RC osc configuration

FOSC = 4 MHz, VDD = 5.5V (Note 4)

D013

- 13.5 30 mA HS osc configuration

FOSC = 20 MHz, VDD = 5.5V

D015

Brown-out Reset Current ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V

(Note 5)

D020 Power-down Current

IPD

- 10.5 42 µA VDD = 4.0V, WDT enabled, -40°C to +85°C

D021 (Note 3)

- 1.5 21 µA VDD = 4.0V, WDT disabled, -0°C to +70°C

D021A

- 1.5 24 µA VDD = 4.0V, WDT disabled, -40°C to +85°C

D021B

- 1.5 30 µA VDD = 4.0V, WDT disabled, -40°C to +125°C

D023

Brown-out Reset Current ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V

(Note 5)

* These parameters are characterized but not tested.

† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

DS30272A-page 90

© 1997 Microchip Technology Inc.

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