PIC18LF4682-I/ML 查看數據表（PDF） - Microchip Technology

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PIC18LF4682-I/ML

28/40/44-Pin Enhanced Flash Microcontrollers with ECAN™ Technology, 10-Bit A/D and nanoWatt Technology

Microchip Technology 

PIC18F2682/2685/4682/4685

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

NOTE 1

E1

123

D

E

A

A2

L

c

b1

A1

b

e

eB

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

40

Pitch

e

.100 BSC

Top to Seating Plane

A

–

–

.250

Molded Package Thickness

A2

.125

–

.195

Base to Seating Plane

A1

.015

–

–

Shoulder to Shoulder Width

E

.590

–

.625

Molded Package Width

E1

.485

–

.580

Overall Length

D

1.980

–

2.095

Tip to Seating Plane

L

.115

–

.200

Lead Thickness

c

.008

–

.015

Upper Lead Width

b1

.030

–

.070

Lower Lead Width

b

.014

–

.023

Overall Row Spacing §

eB

–

–

.700

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-016B

© 2007 Microchip Technology Inc.

Preliminary

DS39761B-page 459

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