Si3000
6. Package Outline: 16-Pin SOIC
Figure 19 illustrates the package details for the Si3000. Table 15 lists the values for the dimensions shown in the
illustration.
Figure 19. 16-Pin Small Outline Integrated Circuit (SOIC) Package
Table 15. Package Diagram Dimensions
Dimension
A
A1
A2
b
c
D
E
E1
e
Min
Max
—
1.75
0.10
0.25
1.25
—
0.31
0.51
0.17
0.25
9.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
Dimension
L
L2
h
θ
aaa
bbb
ccc
ddd
Min
Max
0.40
1.27
0.25 BSC
0.25
0.50
0°
8°
0.10
0.20
0.10
0.25
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
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Rev. 1.4