PIC16LC717T-I/SO 查看數據表（PDF） - Microchip Technology
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PIC16LC717T-I/SO Datasheet PDF : 200 Pages
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PIC16C717/770/771
17.2 18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
c
β
eB
A1
B1
B
L
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
Pitch
p
18
.100
18
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.890
.898
.905
22.61
22.80
22.99
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
eB
.310
.370
.430
7.87
9.40
10.92
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
© 1999 Microchip Technology Inc.
Advanced Information
DS41120A-page 181
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