PIC16C52T-04E/P 查看數據表（PDF） - Microchip Technology
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PIC16C52T-04E/P Datasheet PDF : 217 Pages
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Package Type: K04-079 28-Lead Plastic Dual In-line (P) – 600 mil
E
PIC16C5X
D
2
n
1
α
E1
A
R
c
A1
L
β
A2
eB
B1
B
p
Units
Dimension Limits
PCB Row Spacing
Number of Pins
n
Pitch
p
Lower Lead Width
B
Upper Lead Width
B1†
Shoulder Radius
R
Lead Thickness
c
Top to Seating Plane
A
Top of Lead to Seating Plane A1
Base to Seating Plane
A2
Tip to Seating Plane
L
Package Length
D‡
Molded Package Width
E‡
Radius to Radius Width
E1
Overall Row Spacing
eB
Mold Draft Angle Top
α
Mold Draft Angle Bottom
β
MIN
0.014
0.040
0.000
0.008
0.160
0.081
0.015
0.115
1.380
0.505
0.567
0.640
5
5
INCHES*
NOM
0.600
28
0.100
0.016
0.050
0.005
0.012
0.173
0.101
0.023
0.125
1.395
0.550
0.577
0.660
10
10
MAX
0.018
0.060
0.010
0.015
0.185
0.121
0.030
0.135
1.465
0.555
0.587
0.680
15
15
MILLIMETERS
MIN
NOM
15.24
28
2.54
0.36
0.41
1.02
1.27
0.00
0.13
0.20
0.29
4.06
4.38
2.04
2.55
0.38
0.57
2.92
3.18
35.05
35.43
12.80
13.97
14.40
14.66
16.26
16.76
5
10
5
10
MAX
0.46
1.52
0.25
0.38
4.70
3.06
0.76
3.43
37.20
14.10
14.91
17.27
15
15
* Controlling Parameter.
† Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
© 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 197
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