ST6208LD1/CCC 查看數據表（PDF） - STMicroelectronics
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ST6208LD1/CCC
STMicroelectronics
ST6208LD1/CCC Datasheet PDF : 104 Pages
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ST6208C/ST6209C/ST6210C/ST6220C
11.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 78 and Figure 79.
Recommended glue for SMD plastic packages:
s Heraeus: PD945, PD955
s Loctite: 3615, 3298
FiguTreem7p8. [.°RC]ec221150505o00000mm0000000000e0000000000P0000000000Pn0000000000HRd00000000000000000000AEe0000000000dSH00000000000000000000EEW0000000000A00000000000000000000Ta00000000008Iv0000000000N00000000000e0000000000G°0000000000CS00000000000000000000o0000000000l0000000000d00000000000000000000e0000000000r0000000000i0000000000n0000000000g00000000000000000000SP00000000005POH00000000000000000000rsAL0000000000oeDS0000000000cf0000000000EEi0000000000lRe00000000000000000000I0000000000N(w0000000000G0000000000i0000000000t0000000000h0000000000000000000030000000000000000000070000000000%000000000000000000000000000000S00000000000000000000n0000000000C(0000000000RaO0000000000O0000000000nO0000000000Od0000000000L0000000000MI00000000006N00000000003T0000000000G0000000000%E0000000000PM00000000000000000000HPP0000000000Ab0000000000E0000000000S)R0000000000E0000000000A0000000000T00000000000000000000U0000000000R00000000000000000000E00000000000000000000)0000000000
0
Time [sec]
20
40
60
80
100
120
140
160
Figure 79. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
200
150
Temp. [°C]
100
50
90 sec at 125°C
ramp up
2°C/sec for 50sec
Tmax=220+/-5°C
for 25 sec
150 sec above 183°C
ramp down natural
2°C/sec max
0
Time [sec]
100
200
300
400
93/104
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