ST72511R7T6 查看數據表（PDF） - STMicroelectronics
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ST72511R7T6
STMicroelectronics
ST72511R7T6 Datasheet PDF : 164 Pages
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ST72311R, ST72511R, ST72512R, ST72532R
13 PACKAGE CHARACTERISTICS
13.1 PACKAGE MECHANICAL DATA
Figure 93. 64-Pin Thin Quad Flat Package
L1
L
K
Figure 94. 64-Pin Epoxy Thin Quad Flat Package
∅P
L1 L
e
∅n
B
A1
ETQFP 64
mm
inches
Dim
Min Typ Max Min Typ Max
A
1.60
0.063
A1 0.05
0.15 0.002
0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.30 0.37 0.45 0.012 0.015 0.018
C 0.09
0.20 0.004
0.008
D
16.00
0.630
D1
14.00
0.551
D3
12.00
0.472
E
16.00
0.630
E1
14.00
0.551
E3
12.00
0.472
e
0.80
0.031
K 0° 3.5° 7°
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.039
Number of Pins
N 64
ND 16 NE 16
mm
inches
Dim
Min Typ Max Min Typ Max
A
2.40
0.095
A1
0.60
0.024
B 0.25 0.38 0.50 0.010 0.015 0.020
E 15.80 16.00 16.20 0.622 0.630 0.638
E1 12.20 12.35 12.50 0.480 0.486 0.492
G
e
0.80
0.031
G
13.10
0.515
L 0.50
0.020
L1 1.10
0.043
∅n
0.35
0.013
∅P
1.10
0.043
A
N
Number of Pins
64 (4x16)
Note: “ QUALIFICATION OR VOLUME PRODUCTION OF DEVICES USING EPOXY PACKAGES
(ESO/EDIL/EQFP) IS NOT AUTHORIZED It is expressly specified that qualification and/or volume production of devices
using the package E.... in any applications is not authorized. Usage in any application is strictly restricted to development
purpose. Similar devices are available in plastic package mechanically compatible to the epoxy package for qualification
and volume production.”
154/164
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