STM32F030CC 查看數據表（PDF） - STMicroelectronics
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STM32F030CC
STMicroelectronics
STM32F030CC Datasheet PDF : 91 Pages
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Package information
STM32F030x4/x6/x8/xC
7.4
TSSOP20 package information
TSSOP20 is a 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch package.
Figure 36.TSSOP20 outline
ϮϬ
ϭ
W/Eϭ
/ Ed/&/d/KE
ĂĂĂ
ď
ϭϭ
ϭ
^ d/E'
W>E
ϭϬ
ϭ
Ϯ
Ğ
Đ
Ϭ͘Ϯϱŵŵ
'h' W>E
Ŭ
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1. Drawing is not to scale.
Symbol
Table 62. TSSOP20 mechanical data
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
A
-
-
1.200
-
-
A1
0.050
-
0.150
0.0020
-
A2
0.800
1.000
1.050
0.0315
0.0394
b
0.190
-
0.300
0.0075
-
c
0.090
-
0.200
0.0035
-
D
6.400
6.500
6.600
0.2520
0.2559
E
6.200
6.400
6.600
0.2441
0.2520
E1
4.300
4.400
4.500
0.1693
0.1732
e
-
0.650
-
-
0.0256
L
0.450
0.600
0.750
0.0177
0.0236
L1
-
1.000
-
-
0.0394
zͺD ͺsϯ
Max.
0.0472
0.0059
0.0413
0.0118
0.0079
0.2598
0.2598
0.1772
-
0.0295
-
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