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TC1313-RM3EMFTR 查看數據表(PDF) - Microchip Technology

零件编号
产品描述 (功能)
生产厂家
TC1313-RM3EMFTR
Microchip
Microchip Technology 
TC1313-RM3EMFTR Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
TC1313
10-Lead Plastic Micro Small Outline Package (UN) (MSOP*)
E
E1
p
B
n
D
2
1
c
(F)
β
φ
A
A1
L
L1
α
A2
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Overall Width
E
Molded Package Width
E1
MIN
-
.030
.000
INCHES
NOM
10
.020 TYP
-
.033
-
.193 BSC
.118 BSC
MAX
.043
.037
.006
MILLIMETERS*
MIN
NOM
10
0.50 TYP.
-
-
0.75
0.85
0.00
-
4.90 BSC
3.00 BSC
Overall Length
D
.118 BSC
3.00 BSC
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
L
.016
.024
.031
0.40
0.60
F
.037 REF
0.95 REF
φ
-
-
c
.003
-
.009
0.08
-
B
.006
.009
.012
0.15
0.23
α
-
15°
-
β
-
15°
-
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-021
MAX
1.10
0.95
0.15
0.80
0.23
0.30
15°
15°
* The MSOP package for the TC1313 has not been qualified at the time of this publication.
Contact your Microchip sales office for availability.
DS21974A-page 22
© 2005 Microchip Technology Inc.

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