TCN75AVUA. 查看數據表（PDF） - Microchip Technology
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TCN75AVUA. Datasheet PDF : 32 Pages
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TCN75A
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil Body (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
B
n
E
E1
D
2
1
45°
c
β
h
A
φ
L
A1
α
A2
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
8
p
.050
8
1.27
Overall Height
A
.053
.061
.069
1.35
1.55
1.75
Molded Package Thickness
A2
.052
.056
.061
1.32
1.42
1.55
Standoff
§
A1
.004
.007
.010
0.10
0.18
0.25
Overall Width
E
.228
.237
.244
5.79
6.02
6.20
Molded Package Width
E1
.146
.154
.157
3.71
3.91
3.99
Overall Length
D
.189
.193
.197
4.80
4.90
5.00
Chamfer Distance
h
.010
.015
.020
0.25
0.38
0.51
Foot Length
Foot Angle
L
.019
.025
.030
0.48
0.62
0.76
φ
0
4
8
0
4
8
Lead Thickness
c
.008
.009
.010
0.20
0.23
0.25
Lead Width
B
.013
.017
.020
0.33
0.42
0.51
Mold Draft Angle Top
α
0
12
15
0
12
15
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21935C-page 26
© 2006 Microchip Technology Inc.
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