STM6502RFABDG6F 查看數據表（PDF） - STMicroelectronics
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STM6502RFABDG6F Datasheet PDF : 29 Pages
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Package mechanical data
STM6502, STM6503, STM6504, STM6505
Figure 16. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad
D
P
E E1
L
b
AM00441
Table 9. Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm package
Parameter
Description
Dimension (mm)
Min.
Nom.
Max.
L
Contact length
1.05
—
1.15
b
Contact width
0.25
—
0.30
E
Max. land pattern Y-direction
—
2.85
—
E1
Contact gap spacing
—
0.65
—
D
Max. land pattern X-direction
—
1.75
—
P
Contact pitch
—
0.5
—
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Doc ID 16101 Rev 6
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