SST25PF080B-80-4C-SAE 查看數據表（PDF） - Microchip Technology

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SST25PF080B-80-4C-SAE

8 Mbit 2.3-3.6V SPI Serial Flash

Microchip Technology 

SST25PF080B

7.0 PACKAGING DIAGRAMS

Pin #1

Identifier

TOP VIEW

SIDE VIEW

7°

4 places

0.51

5.0

0.33

4.8

1.27 BSC

END VIEW

45°

0.25

0.10

4.00

3.80

1.75

6.20

1.35

0.25

5.80

0.19

Note: 1. Complies with JEDEC publication 95 MS-012 AA dimensions,

although some dimensions may be more stringent.

2. All linear dimensions are in millimeters (max/min).

3. Coplanarity: 0.1 mm

4. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.

08-soic-5x6-SA-8

1mm

7°

4 places

0°

8°

1.27

0.40

FIGURE 7-1:

8-LEAD SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) 150 MIL BODY WIDTH

PACKAGE CODE: SA

DS25134A-page 26

 2012 Microchip Technology Inc.

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