SMP402SC 查看數據表（PDF） - Power Integrations, Inc
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SMP402SC Datasheet PDF : 16 Pages
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SMP402
PACKAGE POWER DERATING
8
Tj = 120°C
6
4
2
0
0
25 50
75 100 125
Case Temperature (°C)
TRANSIENT THERMAL IMPEDANCE
100
10
1
0.1
10-4 10-3 10-2 10-1 1
10 100 1000
Time (s)
S16A
DIM inches
mm
A .398-.413 10.10-10.50
B .050 BSC 1.27 BSC
C .014-.018
0.36-0.46
E .093-.104
2.35-2.65
F .004-.012
0.10-0.30
J .394-.418 10.01-10.62
L .009-.012
0.23-0.32
M .020-.040
0.51-1.02
N .291-.299
7.40-7.60
Notes:
1. Package dimensions conform to JEDEC
specification MS-013-AA for standard small outline
(SO) package, 16 leads, 7.50 mm (.300 inch) body
width (issue A, June 1985).
2. Controlling dimensions are in mm.
3. Dimensions are for the molded body and do not
include mold flash or protrusions. Mold flash or
protrusions shall not exceed .15 mm (.006 inch) on
any side.
4. Pin 1 side identified by chamfer on top edge of
the package body or indent on Pin 1 end.
16
1
C
9
(3)
N
(3)
8
A
EL
B
F
Plastic SO-16 (W)
J
0-8˚ TYP.
M
PI-1846-050196
12 D
1/96
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