SPAKMC331MFC20 查看數據表（PDF） - Motorola => Freescale

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SPAKMC331MFC20

highly-integrated 32-bit microcontroller, 16MHz

Motorola => Freescale 

Table A-3 Thermal Characteristics

Num

Rating

1 Thermal Resistance

Plastic 132-Pin Surface Mount

Plastic 144-Pin Surface Mount

Thin Plastic 144-Pin Surface Mount

Symbol

ΘϑΑ

Value

38

46

49

Unit

°C/W

NOTES:

The average chip-junction temperature (TJ) in C can be obtained from:

TJ = TA + (PD × ΘϑΑ)

(1)

where

TA = Ambient Temperature, °C

ΘϑΑ = Package Thermal Resistance, Junction-to-Ambient, °C/W

PD = PINT + PI/O

PINT = IDD × VDD, Watts — Chip Internal Power

PI/O = Power Dissipation on Input and Output Pins — User Determined

For most applications PI/O < PINT and can be neglected. An approximate relationship between PD and

TJ (if PI/O is neglected) is:

PD = K ÷ (TJ + 273°C)

(2)

Solving equations 1 and 2 for K gives:

K = PD + (TA + 273°C) + ΘϑΑ × PD2

(3)

where K is a constant pertaining to the particular part. K can be determined from equation (3) by mea-

suring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be ob-

tained by solving equations (1) and (2) iteratively for any value of TA.

Table A-4 16.78 MHz Clock Control Timing

(VDD and VDDSYN = 5.0 Vdc ±10%, VSS = 0 Vdc, TA = TL to TH,

32.768 kHz reference)

Num

Characteristic

1 PLL Reference Frequency Range

2 System Frequency1

On-Chip PLL System Frequency

External Clock Operation

3 PLL Lock Time2,3,4,5

4 VCO Frequency6

5 Limp Mode Clock Frequency

SYNCR X bit = 0

SYNCR X bit = 1

6 CLKOUT Stability2,3,4,7

Short term (5 µs interval)

Long term (500 µs interval)

Symbol

fref

fsys

tlpll

fVCO

flimp

Cstab

Min

25

dc

0.131

dc

—

—

—

–0.5

–0.05

Max

50

16.78

16.78

16.78

20

2 (fsys max)

fsys max/2

fsys max

0.5

0.05

Unit

kHz

MHz

ms

MHz

MHz

%

A

MC68331

USER’S MANUAL

ELECTRICAL CHARACTERISTICS

MOTOROLA

A-3

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