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STM32F215VEH6V 查看數據表(PDF) - STMicroelectronics

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STM32F215VEH6V Datasheet PDF : 173 Pages
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Package characteristics
STM32F21xxx
Figure 79. LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm, package outline
C Seating plane
A A2
0.25 mm
gauge plane
A1
ccc C
HD
D
ZD
132
133
b
c
A1
ZE
89
88
k
L
L1
E HE
1. Drawing is not to scale.
176
Pin 1
1
identification
45
44
e
1T_ME
Table 87. LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm package mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
1.600
A1
0.050
0.150
0.0020
A2
1.350
1.450
0.0531
b
0.170
0.270
0.0067
c
0.090
0.200
0.0035
D
23.900
24.100
0.9409
E
23.900
24.100
0.9409
e
0.500
HD
25.900
26.100
1.0197
HE
25.900
L(2)
0.450
26.100
0.750
1.0197
0.0177
L1
1.000
ZD
1.250
ZE
1.250
k
ccc
0.080
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. L dimension is measured at gauge plane at 0.25 mm above the seating plane.
0.0197
0.0394
0.0492
0.0492
0.0630
0.0059
0.0571
0.0106
0.0079
0.9488
0.9488
1.0276
1.0276
0.0295
0.0031
148/173
Doc ID 17050 Rev 8

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