STM32F051R4U7(2012) 查看數據表（PDF） - STMicroelectronics
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产品描述 (功能)
生产厂家
STM32F051R4U7
(Rev.:2012)
(Rev.:2012)
STMicroelectronics
STM32F051R4U7 Datasheet PDF : 104 Pages
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STM32F051x
Package characteristics
Figure 37. UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package outline (5 x 5)
Seating plane
C
ddd C
A
A3
D
e
9
8
A1
16
17
E2 b
E
Pin # 1 ID
R = 0.30
1
32
D2
Bottom view
24
L
L
A0B8_ME
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
be connected. It is referred to as pin 0 in Table 13: Pin definitions.
Table 71.
Dim.
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data
mm
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.5
0.55
0.6
0.0197
0.0217
0.0236
A1
0.00
0.02
0.05
0
0.0008
0.0020
A3
0.152
0.006
b
0.18
0.23
0.28
0.0071
0.0091
0.0110
D
4.90
5.00
5.10
0.1929
0.1969
0.2008
D2
3.50
0.1378
E
4.90
5.00
5.10
0.1929
0.1969
0.2008
E2
3.40
3.50
3.60
0.1339
0.1378
0.1417
e
0.500
L
0.30
0.40
0.50
0.0118
ddd
0.08
1. Values in inches are converted from mm and rounded to 4 decimal digits.
0.0197
0.0157
0.0031
0.0197
Doc ID 022265 Rev 3
99/105
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