STM32F051X8 查看數據表（PDF） - STMicroelectronics
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STM32F051X8
STMicroelectronics
STM32F051X8 Datasheet PDF : 122 Pages
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STM32F051x4 STM32F051x6 STM32F051x8
Package information
7.5
WLCSP36 package information
WLCSP36 is a 36-ball, 2.605 x 2.703 mm, 0.4 mm pitch wafer-level chip-scale package.
Figure 46. WLCSP36 package outline
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Symbol
A
A1
A2
A3(2)
b(3)
D
E
e
e1
e2
Table 70. WLCSP36 package mechanical data
millimeters
inches(1)
Min
0.525
-
-
-
0.220
2.570
2.668
-
-
-
Typ
0.555
0.175
0.380
0.025
0.250
2.605
2.703
0.400
2.000
2.000
Max
0.585
-
-
-
0.280
2.640
2.738
-
-
-
Min
0.0207
-
-
-
0.0087
0.1012
0.1050
-
-
-
Typ
0.0219
0.0069
0.0150
0.0010
0.0098
0.1026
0.1064
0.0157
0.0787
0.0787
Max
0.0230
-
-
-
0.0110
0.1039
0.1078
-
-
-
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