Package information
STM32F051x4 STM32F051x6 STM32F051x8
Symbol
Table 70. WLCSP36 package mechanical data (continued)
millimeters
inches(1)
Min
Typ
Max
Min
Typ
F
-
0.3025
-
-
0.0119
G
-
0.3515
-
-
0.0138
aaa
-
-
0.100
-
-
bbb
-
-
0.100
-
-
ccc
-
-
0.100
-
-
ddd
-
-
0.050
-
-
eee
-
-
0.050
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Max
-
-
0.0039
0.0039
0.0039
0.0020
0.0020
Figure 47. Recommended pad footprint for WLCSP36 package
'SDG
'VP
069
Table 71. WLCSP36 recommended PCB design rules
Dimension
Recommended values
Pitch
0.4 mm
Dpad
260 µm max. (circular)
220 µm recommended
Dsm
300 µm min. (for 260 µm diameter pad)
PCB pad design
Non-solder mask defined via underbump allowed
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