STM32F051R4T7TR 查看數據表（PDF） - STMicroelectronics
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产品描述 (功能)
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STM32F051R4T7TR
STMicroelectronics
STM32F051R4T7TR Datasheet PDF : 122 Pages
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STM32F051x4 STM32F051x6 STM32F051x8
7
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
7.1
UFBGA64 package information
UFBGA64 is a 64-ball, 5 x 5 mm, 0.5 mm pitch ultra-fine-profile ball grid array
package.
= 6HDWLQJSODQH
Figure 34. UFBGA64 package outline
GGG =
$ $ $
$ $
(
H
)
$EDOO $EDOO
;
LGHQWLILHU LQGH[DUHD
(
$
)
'
'
H
+
<
%277209,(:
1. Drawing is not to scale.
E EDOOV
HHH 0 = < ;
III 0 =
7239,(:
$ B0(B9
Symbol
A
A1
A2
A3
A4
Table 65. UFBGA64 package mechanical data
millimeters
inches(1)
Min
0.460
0.050
0.400
0.080
0.270
Typ
0.530
0.080
0.450
0.130
0.320
Max
0.600
0.110
0.500
0.180
0.370
Min
0.0181
0.0020
0.0157
0.0031
0.0106
Typ
0.0209
0.0031
0.0177
0.0051
0.0126
Max
0.0236
0.0043
0.0197
0.0071
0.0146
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