Package information
STM32F051x4 STM32F051x6 STM32F051x8
Symbol
Table 65. UFBGA64 package mechanical data (continued)
millimeters
inches(1)
Min
Typ
Max
Min
Typ
A
0.460
0.530
0.600
0.0181
0.0209
b
0.170
0.280
0.330
0.0067
0.0110
D
4.850
5.000
5.150
0.1909
0.1969
D1
3.450
3.500
3.550
0.1358
0.1378
E
4.850
5.000
5.150
0.1909
0.1969
E1
3.450
3.500
3.550
0.1358
0.1378
e
-
0.500
-
-
0.0197
F
0.700
0.750
0.800
0.0276
0.0295
ddd
-
-
0.080
-
-
eee
-
-
0.150
-
-
fff
-
-
0.050
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Max
0.0236
0.0130
0.2028
0.1398
0.2028
0.1398
-
0.0315
0.0031
0.0059
0.0020
Figure 35. Recommended footprint for UFBGA64 package
'SDG
'VP
$B)3B9
Table 66. UFBGA64 recommended PCB design rules
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.100 mm
92/122
DocID022265 Rev 7