PIC16LF1503-I/P 查看數據表（PDF） - Microchip Technology
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PIC16LF1503-I/P Datasheet PDF : 352 Pages
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PIC16(L)F1503
16-Lead Ultra Thin Quad Flat Pack, No Lead (MV) - 3x3x0.50 mm Body (UQFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C2
X2
C2 Y2
E
X1
Y1
SILK SCREEN
RECOMMENDED LAND PATTERN
Notes:
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X16)
X1
Contact Pad Length (X16)
Y1
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
1.70
1.70
2.90
2.90
0.30
0.80
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2211A
DS40001607D-page 346
2011-2015 Microchip Technology Inc.
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