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STM32F100C8H7BTR(2010) 查看數據表(PDF) - STMicroelectronics

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STM32F100C8H7BTR Datasheet PDF : 84 Pages
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Package characteristics
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Figure 40. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
B
D
A
D1
A
A1
e
F
A3
A4
A2
Seating
plane C
1. Drawing is not to scale.
H
G
F
E
D
C
B
A
12345678
A1 ball pad corner
Øb (64 balls)
F
E1 E
e
Bottom view
ME_R8
Table 49.
Symbol
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
1.200
A1
0.150
0.0059
A2
0.785
A3
0.200
A4
0.600
b
0.250
0.300
0.350
0.0098
D
4.850
5.000
5.150
0.1909
D1
3.500
E
4.850
5.000
5.150
0.1909
E1
3.500
e
0.500
F
0.750
ddd
0.080
eee
0.150
fff
0.050
1. Values in inches are converted from mm and rounded to 4 decimal digits.
0.0309
0.0079
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
0.0472
0.0236
0.0138
0.2028
0.2028
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Doc ID 16455 Rev 2

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