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DSPIC33FJ64GP310AT-I/PF 查看數據表(PDF) - Microchip Technology

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DSPIC33FJ64GP310AT-I/PF
Microchip
Microchip Technology 
DSPIC33FJ64GP310AT-I/PF Datasheet PDF : 322 Pages
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dsPIC33FJXXXGPX06/X08/X10
25.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJXXXGPX06/X08/X10 electrical characteristics. Additional information
will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33FJXXXGPX06/X08/X10 family are listed below. Exposure to these maximum
rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any
other conditions above the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias.............................................................................................................. .-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V)
Voltage on any digital-only pin with respect to VSS .................................................................................. -0.3V to +5.6V
Voltage on VCAP/VDDCORE with respect to VSS ....................................................................................... 2.25V to 2.75V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin(2)...........................................................................................................................250 mA
Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA
Maximum output current sourced by any I/O pin(3)...................................................................................................4 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports(2)...............................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 25-2).
3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx
and PGEDx pins, which are able to sink/source 12 mA.
© 2009 Microchip Technology Inc.
DS70286C-page 257

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