STM32F091VCY6TR 查看數據表（PDF） - STMicroelectronics

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STM32F091VCY6TR

ARM®-based 32-bit MCU, up to 256 KB Flash, CAN, 12 timers, ADC, DAC, and comm. interfaces, 2.0 - 3.6V

STMicroelectronics 

Package information

7

Package information

STM32F091xB STM32F091xC

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

7.1

UFBGA100 package information

UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array

package.

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Figure 33. UFBGA100 package outline

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1. Drawing is not to scale.

Symbol

A

A1

A2

A3

A4

Table 70. UFBGA100 package mechanical data

millimeters

inches(1)

Min.

-

-

-

-

-

Typ.

-

-

0.450

0.130

0.320

Max.

0.600

0.110

-

-

-

Min.

-

-

-

-

-

Typ.

-

-

0.0177

0.0051

0.0126

Max.

0.0236

0.0043

-

0.0094

-

100/128

DocID026284 Rev 4

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