STM32F091VB 查看數據表（PDF） - STMicroelectronics
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产品描述 (功能)
生产厂家
STM32F091VB
STMicroelectronics
STM32F091VB Datasheet PDF : 128 Pages
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Package information
STM32F091xB STM32F091xC
7.3
UFBGA64 package information
UFBGA64 is a 64-ball, 5 x 5 mm, 0.5 mm pitch ultra-fine-profile ball grid array
package.
= 6HDWLQJSODQH
Figure 39. UFBGA64 package outline
GGG =
$ $ $
$ $
(
H
)
$EDOO $EDOO
;
LGHQWLILHU LQGH[DUHD
(
$
)
'
'
H
+
<
%277209,(:
1. Drawing is not to scale.
E EDOOV
HHH 0 = < ;
III 0 =
7239,(:
$ B0(B9
Symbol
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
Table 73. UFBGA64 package mechanical data
millimeters
inches(1)
Min
0.460
0.050
0.400
0.080
0.270
0.170
4.850
3.450
4.850
3.450
-
0.700
Typ
0.530
0.080
0.450
0.130
0.320
0.280
5.000
3.500
5.000
3.500
0.500
0.750
Max
0.600
0.110
0.500
0.180
0.370
0.330
5.150
3.550
5.150
3.550
-
0.800
Min
0.0181
0.0020
0.0157
0.0031
0.0106
0.0067
0.1909
0.1358
0.1909
0.1358
-
0.0276
Typ
0.0209
0.0031
0.0177
0.0051
0.0126
0.0110
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
Max
0.0236
0.0043
0.0197
0.0071
0.0146
0.0130
0.2028
0.1398
0.2028
0.1398
-
0.0315
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DocID026284 Rev 4
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