STM32F091VCY6TR 查看數據表（PDF） - STMicroelectronics

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STM32F091VCY6TR

ARM®-based 32-bit MCU, up to 256 KB Flash, CAN, 12 timers, ADC, DAC, and comm. interfaces, 2.0 - 3.6V

STMicroelectronics 

Package information

STM32F091xB STM32F091xC

Table 75. WLCSP64 package mechanical data (continued)

Symbol

b(2)

Min

0.220

millimeters

Typ

0.250

Max

0.280

Min

0.0087

inches(1)

Typ

0.0098

D

3.312

3.347

3.382

0.1304

0.1318

E

3.550

3.585

3.620

0.1398

0.1411

e

-

0.400

-

-

0.0157

e1

-

2.800

-

-

0.1102

e2

-

2.800

-

-

0.1102

F

-

0.2735

-

-

0.0108

G

-

0.3925

-

-

0.0155

aaa

-

-

0.100

-

-

bbb

-

-

0.100

-

-

ccc

-

-

0.100

-

-

ddd

-

-

0.050

-

-

eee

-

-

0.050

-

-

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Max

0.0110

0.1331

0.1425

-

-

-

-

-

0.0039

0.0039

0.0039

0.0020

0.0020

Figure 43. Recommended footprint for WLCSP64 package

'SDG

'VP

069

Table 76. WLCSP64 recommended PCB design rules

Dimension

Recommended values

Pitch

0.4

Dpad

260 µm max. (circular)

220 µm recommended

Dsm

300 µm min. (for 260 µm diameter pad)

PCB pad design

Non-solder mask defined via underbump allowed.

110/128

DocID026284 Rev 4

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