STM32F091RC 查看數據表（PDF） - STMicroelectronics

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STM32F091RC

ARM®-based 32-bit MCU, up to 256 KB Flash, CAN, 12 timers, ADC, DAC, and comm. interfaces, 2.0 - 3.6V

STMicroelectronics 

Package information

STM32F091xB STM32F091xC

7.7

UFQFPN48 package information

UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package.

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Figure 51. UFQFPN48 package outline

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1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this back-side pad to PCB ground.

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DocID026284 Rev 4

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