STM32F091CBU7TR 查看數據表（PDF） - STMicroelectronics

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STM32F091CBU7TR

STMicroelectronics

STM32F091CBU7TR Datasheet PDF : 128 Pages

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STM32F091xB STM32F091xC

Package information

7.8

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 24: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 80. Package thermal characteristics

Symbol

Parameter