STM32F373VC(2013) 查看數據表（PDF） - STMicroelectronics

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STM32F373VC
(Rev.:2013)

ARM Cortex-M4 32b MCU+FPU, up to 256KB Flash+32KB SRAM timers, 4 ADCs (12/16-bit), 3 DACs, 2 comp., 2.0-3.6 V operation

STMicroelectronics 

Package characteristics

STM32F37xxx

Figure 33. UFBGA100 – ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch,

package outline

A1 ball

pad corner

1.75

D

1.75

X

Y

0.10 Z

FD

D1

0.50

E

0.10

A1

A

A2

A1 ball

pad corner

b

E1

e

FE

Top view

Side view

Bottom view

A0C2_ME

1. Drawing is not to scale.

Table 76. UFBGA100 – ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package

mechanical data

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

A

0.46

0.53

0.6

0.0181

A1

0.06

0.08

0.1

0.0024

A2

0.4

0.45

0.5

0.0157

b

0.2

0.25

0.3

0.0079

D

-

7

-

-

D1

-

5.5

-

-

E

-

7

-

-

E1

-

5.5

-

-

e

-

0.5

-

-

FD

-

0.75

-

-

FE

-

0.75

-

-

1. Values in inches are converted from mm and rounded to 4 decimal digits.

0.0209

0.0031

0.0177

0.0098

0.2756

0.2165

0.2756

0.2165

0.0197

0.0295

0.0295

0.0236

0.0039

0.0197

0.0118

-

-

-

-

-

-

-

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DocID022691 Rev 4

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