STM32F302VCY7 查看數據表（PDF） - STMicroelectronics

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STM32F302VCY7

ARM®-based Cortex®-M4 32b MCU+FPU, up to 256KB Flash+ 40KB SRAM, 2 ADCs, 1 DAC ch., 4 comp, 2 PGA, timers, 2.0-3.6 V

STMicroelectronics 

STM32F302xB STM32F302xC

Package information

Figure 49. WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale

package recommended footprint

'SDG

'VP

:/&63/B$4B)3B9

Table 85. WLCSP100 recommended PCB design rules (0.4 mm pitch)

Dimension

Recommended values

Pitch

Dpad

Dsm

Stencil thickness

0.4 mm

0.225 mm

0.290 mm

0.1 mm

DocID025186 Rev 7

135/144

140

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