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STM32F302CCY6TR 查看數據表(PDF) - STMicroelectronics

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STM32F302CCY6TR Datasheet PDF : 144 Pages
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Package information
STM32F302xB STM32F302xC
Marking of engineering samples
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 50. WLCSP100, 0.4 mm pitch wafer level chip scale package
top view example
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1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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DocID025186 Rev 7

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