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FM25MS08C-85CB2R 查看數據表(PDF) - FIDELIX

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FM25MS08C-85CB2R Datasheet PDF : 61 Pages
First Prev 51 52 53 54 55 56 57 58 59 60
13. PACKAGE SPECIFICATION
13.1 8-Pin SOIC 208-mil
FM25Q32
SYMBOL
A
A1
A2
b
C
D
E
E1
e
L
θ
y
MILLIMETERS
MIN
MAX
1.75
2.16
0.05
0.25
1.70
1.91
0.35
0.48
0.19
0.25
5.18
5.38
7.70
8.10
5.18
5.38
1.27 BSC
0.50
0.80
---
0.10
INCHES
MIN
MAX
0.069
0.085
0.002
0.010
0.067
0.075
0.014
0.019
0.007
0.010
0.204
0.212
0.303
0.319
0.204
0.212
0.050 BSC
0.020
0.031
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the
bottom of the package.
4. Formed leads shall be planar with respect to one another within. 0004 inches at the seating
plane.
preliminary(Aug.18.2010) 56

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