STM32F031F6Y7(2015) 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

生产厂家

STM32F031F6Y7
(Rev.:2015)

ARM®-based 32-bit MCU with up to 32 Kbyte Flash, 9 timers, ADC and communication interfaces, 2.0 - 3.6 V

STMicroelectronics 

STM32F031x4 STM32F031x6

Package information

Figure 37. UFQFPN32 package outline

'

H

'

E

$

GGG &

$

$

&

6($7,1*

3/$1(

( E

H

( (





'

3,1,GHQWLILHU

/

/

!"?-%?6

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device

ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.

DocID025743 Rev 4

87/106

102

Share Link: