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STM32F038K6P6TR 查看數據表(PDF) - STMicroelectronics

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STM32F038K6P6TR Datasheet PDF : 102 Pages
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STM32F038x6
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Package information
Figure 33. UFQFPN32 package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.
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