STM32F302VC 查看數據表（PDF） - STMicroelectronics
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STM32F302VC Datasheet PDF : 133 Pages
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Electrical characteristics
STM32F302xx/STM32F303xx
6.3
6.3.1
Operating conditions
General operating conditions
Table 22. General operating conditions
Symbol
Parameter
Conditions
Min Max Unit
fHCLK
fPCLK1
fPCLK2
VDD
VDDA
VBAT
VIN
PD
TA
TJ
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(OPAMP and DAC not used)
Analog operating voltage
(OPAMP and DAC used)
Must have a potential
equal to or higher than
VDD
Backup operating voltage
TC I/O
I/O input voltage
TTa I/O
FT and FTf I/O(1)
BOOT0
Power dissipation at TA =
85 °C for suffix 6 or TA =
105 °C for suffix 7(2)
LQFP100
LQFP64
LQFP48
Ambient temperature for 6
suffix version
Maximum power
dissipation
Low power dissipation(3)
Ambient temperature for 7
suffix version
Maximum power
dissipation
Low power dissipation(3)
Junction temperature range
6 suffix version
7 suffix version
0
72
0
36
MHz
0
72
2
3.6
V
2
3.6
V
2.4
3.6
1.65
3.6
V
–0.3 VDD+0.3
–0.3 VDDA+0.3
V
–0.3
5.5
0
5.5
-
488
-
444 mW
-
364
–40
85
°C
–40
105
–40
105
°C
–40
125
–40
105
°C
–40
125
1. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 21: Thermal
characteristics).
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 21: Thermal characteristics).
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Doc ID 023353 Rev 5
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