M24256-BFMN6G(2012) 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

生产厂家

M24256-BFMN6G
(Rev.:2012)

256-Kbit serial I²C bus EEPROM

STMicroelectronics 

Package mechanical data

M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF

9

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 15. TSSOP8 – 8-lead thin shrink small outline, package outline

32/40

1. Drawing is not to scale.

Table 18.

Symbol

TSSOP8 – 8-lead thin shrink small outline, package mechanical data

millimeters

inches(1)

Typ.

Min.

Max.

Typ.

Min.

Max.

A

1.200

A1

0.050

0.150

A2

1.000

0.800

1.050

0.0394

b

0.190

0.300

c

0.090

0.200

CP

0.100

D

3.000

2.900

3.100

0.1181

e

0.650

0.0256

E

6.400

6.200

6.600

0.2520

E1

4.400

4.300

4.500

0.1732

L

0.600

0.450

0.750

0.0236

L1

1.000

0.0394

α

0°

8°

1. Values in inches are converted from mm and rounded to four decimal digits.

0.0020

0.0315

0.0075

0.0035

0.1142

0.2441

0.1693

0.0177

0°

0.0472

0.0059

0.0413

0.0118

0.0079

0.0039

0.1220

0.2598

0.1772

0.0295

8°

Doc ID 6757 Rev 30

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