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SL23EP08ZC-1HT 查看數據表(PDF) - Silicon Laboratories

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SL23EP08ZC-1HT Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
SL23EP08
Package Drawing and Dimensions
16-Lead TSSOP (4.4mm)
16
Pin-1 ID
1
9
6.250(0.246)
6.500(0.256)
4.300(0.169)
4.500(0.177)
8
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
0.850(0.033)
0.950(0.037)
0.190(0.007)
0.300(0.012)
2.900(0.114)
3.100(0.122)
0.650(0.025)
BSC
1.100(0.043) MAX
0.050(0.002)
0.150(0.006)
0.076(0.003)
Seating Plane
0.650(0.025)
BSC
Gauge
Plane
0 to 8°
0.500(0.020)
0.700(0.027)
0.090(0.003)
0.200(0.008)
Thermal Characteristics
Parameter
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Symbol
θ JA
θ JA
θ JA
θ JC
Condition
Still air
1m/s air flow
3m/s air flow
Independent of air flow
Min Typ
-
80
-
70
-
68
-
36
Max
-
-
-
-
Unit
°C/W
°C/W
°C/W
°C/W
Rev 1.0, May 18, 2006
Page 13 of 15

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