LBM673-L1M2-25 查看數據表（PDF） - OSRAM GmbH
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LBM673-L1M2-25 Datasheet PDF : 17 Pages
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LB M673, LT M673
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
300
˚C
T 250
200
240 ˚C
217 ˚C
150
tS
100
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020D.01)
(acc. to J-STD-020D.01)
OHA04525
Tp 245 ˚C
tP
tL
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Pb-Free (SnAgCu) Assembly
Ramp-up Rate to Preheat*)
25°C to 150°C
Recommendation
2°C / sec
Max. Ratings
3°C / sec
Time ts from TSmin to TSmax
(150°C to 200°C
100s
min. 60sec max. 120sec
Ramp-up Rate to Peak*)
180°C to TP
Liquidus Temperture TL
Time tL above TL
Peak Temperature TP
Time tP within 5°C of the specified
peak temperature TP - 5K
Ramp-down Rate*
TP to 100°C
Time 25°C to Peak temperature
2°C / sec
80sec
245°C
20sec
3°K / sec
3°C / sec
217°C
max. 100sec
max. 260°C
min. 10sec max. 30sec
6°K / sec maximum
max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ∆T/∆t: ∆t max. 5 sec; fulfillment for the whole T-range
2012-06-15
12
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