GS9076 Data Sheet
2.4 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was
performed using the maximum Pb-free reflow profile shown in Figure 2-3. The
recommended standard Pb reflow profile is shown in Figure 2-4.
Temperature
260˚C
250˚C
217˚C
200˚C
3˚C/sec max
60-150 sec.
20-40 sec.
6˚C/sec max
150˚C
25˚C
60-180 sec. max
8 min. max
Time
Figure 2-3: Maximum Pb-free Solder Reflow Profile (Preferred)
Temperature
230˚C
220˚C
183˚C
150˚C
100˚C
3˚C/sec max
60-150 sec.
10-20 sec.
6˚C/sec max
25˚C
120 sec. max
6 min. max
Time
Figure 2-4: Standard Pb Solder Reflow Profile
44617 - 1 January 2008
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