ST72325S6B5(2007) 查看數據表（PDF） - STMicroelectronics

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ST72325S6B5
(Rev.:2007)

8-bit MCU with 16 to 60K Flash/ROM, ADC, CSS, 5 timers, SPI, SCI, I2C interface

STMicroelectronics 

13.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

LQFP64 10x10

LQFP48 7x7

LQFP44 10x10

SDIP42

LQFP32 7x7

SDIP32

Power dissipation 1)

Maximum junction temperature 2)

Value

50

80

52

55

70

50

500

150

Unit

°C/W

mW

°C

Notes:

1. The maximum chip-junction temperature is based on technology characteristics.

2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is

the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the applica-

tion.

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