STM32WB55CCU7 查看數據表（PDF） - STMicroelectronics

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STM32WB55CCU7

Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

STMicroelectronics 

STM32WB55xx STM32WB35xx

Package information

Figure 42. WLCSP100 recommended footprint

Dpad

Dsm

1. Dimensions are expressed in millimeters.

A08S_WLCSP100_FP_V1

Table 103. WLCSP100 recommended PCB design rules

Dimension

Recommended values

Pitch

Dpad

Dsm

Stencil opening

0.4 mm

0.225 mm

0.290 mm typ. (depends on the soldermask registration tolerance)

0.250 mm

Stencil thickness

0.100 mm

Device marking for WLCSP100

Figure 43 gives an example of topside marking orientation versus pin 1 identifier location.

The printed markings may differ depending on the supply chain.

Other optional marking or inset/upset marks, which identify the parts throughout supply

chain operations, are not indicated below.

DS11929 Rev 10

175/193

185

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