STM32WB55VC 查看數據表（PDF） - STMicroelectronics

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STM32WB55VC

Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

STMicroelectronics 

STM32WB55xx STM32WB35xx

Package information

7.5

Note:

Note:

Note:

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 24: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated

using the equation:

TJ max = TA max + (PD max x ΘJA)

where:

 TA max is the maximum ambient temperature in °C,

 ΘJA is the package junction-to-ambient thermal resistance, in °C / W,

 PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max),

 PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins:

 PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

When the SMPS is used, a portion of the power consumption is dissipated into the external

inductor, therefore reducing the chip power dissipation. This portion depends mainly on the

inductor ESR characteristics.

As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the

chip power consumption.

RF characteristics (such as sensitivity, Tx power, consumption) are provided up to 85 °C.

Symbol

ΘJA

ΘJB

Table 106. Package thermal characteristics

Parameter

Value

Thermal resistance junction-ambient

UFQFPN48 - 7 mm x 7 mm

24.9

Thermal resistance junction-ambient

VFQFPN68 - 8 mm x 8 mm

47.0

Thermal resistance junction-ambient

WLCSP100 - 0.4 mm pitch

35.8

Thermal resistance junction-ambient

UFBGA129 - 0.5 mm pitch

41.5

Thermal resistance junction-board

UFQFPN48 - 7 mm x 7 mm

13.0

Thermal resistance junction-board

VFQFPN68 - 8 mm x 8 mm

36.1

Thermal resistance junction-board

WLCSP100 - 0.4 mm pitch

N/A

Thermal resistance junction-board

UFBGA129 - 0.5 mm pitch

16.2

Unit

°C/W

°C/W

DS11929 Rev 10

183/193

185

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