AD9785-EBZ 查看數據表（PDF） - Analog Devices
零件编号
产品描述 (功能)
生产厂家
AD9785-EBZ Datasheet PDF : 64 Pages
| |||
AD9785/AD9787/AD9788
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD33 to AGND, DGND, CGND
DVDD33, DVDD18, CVDD18
to AGND, DGND, CGND
AGND to DGND, CGND
DGND to AGND, CGND
CGND to AGND, DGND
I120, VREF, IPTAT to AGND
OUT1_P, OUT1_N, OUT2_P, OUT2_N,
AUX1_P, AUX1_N, AUX2_P,
AUX2_N to AGND
P1D[15] to P1D[0], P2D[15] to P2D[0]
to DGND
DATACLK, TXENABLE to DGND
REFCLK+, REFCLK−, RESET, IRQ,
PLL_LOCK, SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I− to CGND
RESET, IRQ, PLL_LOCK, SYNC_O+,
SYNC_O−, SYNC_I+, SYNC_I−,
SPI_CSB, SCLK, SPI_SDIO, SPI_SDO
to DGND
Junction Temperature
Storage Temperature Range
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
For this 100-lead, thermally enhanced TQFP, the exposed paddle
(EPAD) must be soldered to the ground plane. Note that these
specifications are valid with no airflow movement.
Table 5. Thermal Resistance
Resistance Unit
Conditions
θJA
19.1°C/W EPAD soldered. No airflow.
θJB
12.4°C/W EPAD soldered. No airflow.
θJC
7.1°C/W EPAD soldered. No airflow.
ESD CAUTION
Rev. 0 | Page 6 of 64
Share Link: 