XMEGA A1
‘
1. Ordering Information
Ordering Code
ATxmega384A1-AU
ATxmega256A1-AU
ATxmega192A1-AU
ATxmega128A1-AU
ATxmega64A1-AU
ATxmega384A1-CU
ATxmega256A1-CU
ATxmega192A1-CU
ATxmega128A1-CU
ATxmega64A1-CU
Flash (B)
384K + 8K
256K + 8K
192K + 8K
128K + 8K
64K + 4K
384K + 8K
256K + 8K
192K + 8K
128K + 8K
64K + 4K
E2 (B)
4K
4K
2K
2K
2K
4K
4K
2K
2K
2K
SRAM (B)
32K
16K
16K
8K
4K
32K
16K
16K
8K
4K
Speed (MHz)
32
32
32
32
32
32
32
32
32
32
Power Supply
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
Package(1)(2)(3)
100A
100C1
Temp
-40° - 85°C
Notes:
1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For packaging information, see “Packaging information” on page 63.
100A
100C1
Package Type
100-lead, 14 x 14 x 1.0 mm, 0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.88 mm, Chip Ball Grid Array (CBGA)
2. Pinout/Block Diagram
Figure 2-1. Block diagram and TQFP-pinout.
INDEX CORNER
PA6
PA7
GND
AVCC
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
GND
VCC
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
GND
VCC
PD0
1
2
Port R
Port Q
3
4
DATA BU S
5
ADC A
6
7
DAC A
OSC/CLK
Contro l
BOD
VREF
POR
8
9
AC A0
10
AC A1
11
Power
Contro l
TEMP
RTC
OCD
FLASH
12
ADC B
13
14
DAC B
Reset
Contro l
CPU
DMA
RAM
E 2PROM
15
16
AC B0
17
AC B1
18
Watchdog
Interrupt Controlle r
Event System ctrl
19
DATA BU S
20
EVENT ROUTING NETWORK
21
22
23
24
25
Port C
Port D
Port E
Port F
75
74
73
72
71
70
69
68
67
Port K 66
65
64
63
Port J 62
61
60
59
Port H 58
57
56
55
54
53
52
51
PK0
VCC
GND
PJ7
PJ6
PJ5
PJ4
PJ3
PJ2
PJ1
PJ0
VCC
GND
PH7
PH6
PH5
PH4
PH3
PH2
PH1
PH0
VCC
GND
PF7
PF6
Note: For full details on pinout and pin functions refer to “Pinout and Pin Functions” on page 48.
2
8067D–AVR–08/08