FOOTPRINT (QSOP28 / TSSOP28)
dim in mm 0.4
1.7
7.1
3.7
0.65
ST1284-xxA8/T8
Package General Specifications
Lead Plating
Tin-Lead
Lead Plating
Thickness
7 µm Min
20 µm Max
Lead Material
Copper Alloy
Lead Coplanarity 0.102 mm (0.004")
Body Material
Molded Epoxy
Resine
Meets UL94V.0 standard
Order code
ST1284-01A8
ST1284-01A8RL
ST1284-02A8
ST1284-02A8RL
ST1284-03A8RL
ST1284-01T8RL
ST1284-02T8RL
ST1284-03T8RL
Marking
ST1284-01
ST1284-01
ST1284-02
ST1284-02
ST1284-03
ST1284-01
ST1284-02
ST1284-03
Package
QSOP28
QSOP28
QSOP28
QSOP28
QSOP28
TSSOP28
TSSOP28
TSSOP28
Weight
0.147 g
0.147 g
0.147 g
0.147 g
0.147 g
0.104 g
0.104 g
0.104 g
Delivery mode
Tube
Tape & Reel
Tube
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Base qty
48
2500
48
2500
2500
2500
2500
2500
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
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