THBT20011D(2008) 查看數據表（PDF） - STMicroelectronics
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THBT20011D Datasheet PDF : 10 Pages
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Package information
3
Package information
THBT15011, THBT20011, THBT27011
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 7. SO-8 dimensions
b
e
ppp C
D
Seating
Plane
C
A2 A
C
A1
k
8
5
E1 E
1
4
Dimensions
Ref.
Millimeters
Inches
h x 45°
L
L1
Min.
A
A1 0.1
A2 1.25
b 0.28
C 0.17
D 4.80
E 5.80
E1 3.80
e
h 0.25
L 0.40
L1
k 0°
ppp
Typ. Max. Min. Typ. Max.
1.75
0.069
0.25 0.004
0.049
0.48 0.011
0.010
0.019
0.23 0.007
0.009
4.90 5.00 0.189 0.193 0.197
6.00 6.20 0.228 0.236 0.244
3.90 4.00 0.150 0.154 0.157
1.27
0.050
0.50 0.010
0.020
1.27 0.016
0.050
1.04
0.041
8° 0°
8°
0.10
0.004
Figure 11. Footprint dimensions
in mm (inches)
Figure 12. Marking
6.8
(0.268)
4.2
(0.165)
0.6
(0.024)
1.27
(0.050)
XXXXX : Marking
ZZ : Manufacturing location
Y : Year
WW : week
xxxxxx
z z y ww
â
Pin 1
8/10
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