STTH112RL View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STTH112RL Datasheet PDF : 8 Pages
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STTH112
Electrical characteristics
Figure 1. Conduction losses versus average Figure 2. Forward voltage drop versus
current
forward current
P(W)
2.2
2.0
1.8
δ = 0.1 δ = 0.2
δ = 0.05
δ = 0.5
1.6
1.4
δ=1
1.2
1.0
0.8
0.6
T
0.4
0.2
IF(AV)(A)
δ=tp/T
tp
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
IFM(A)
100.0
10.0
Tj=125°C
(maximum values)
Tj=125°C
(typical values)
Tj=25°C
(maximum values)
1.0
VFM(V)
0.1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 3.
Relative variation of thermal
Figure 4.
impedance junction ambient versus
pulse duration (DO-41)
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA)
Zth(j-c)/Rth(j-c)
1.0
epoxy FR4, Lleads = 10mm
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1 Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Figure 5.
Relative variation of thermal
Figure 6.
impedance junction ambient versus
pulse duration (epoxy FR4)(SMB)
Thermal resistance junction to
ambient versus copper surface
under each lead (DO-41, SMB)
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Rth(j-a)(°C/W)
110
100
90
80
70
60
50
40
30
20
10
0
0
1
2
epoxy printed circuit board FR4, copper thickness: 35µm
SMB
DO-41
Lleads=10mm
S(cm²)
3
4
5
6
7
8
9
10
Doc ID 9343 Rev 5
3/8
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