STPS1L60RL View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS1L60RL Datasheet PDF : 10 Pages
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Characteristics
STPS1L60
Figure 7.
Non repetitive surge peak forward Figure 8.
current versus overload duration
(maximum values) (SMA)
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
7 IM(A)
6
5
4
3
2
1 IM
0
1.E-04
t
δ = 0.5
1.E-03
t(s)
1.E-02
SMA
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
1.E-01
1.E+00
8 IM(A)
7
6
5
4
3
2
IM
1
0
1.E-04
t
δ = 0.5
1.E-03
t(s)
1.E-02
DO-41
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
1.E-01
1.E+00
Figure 9.
Non repetitive surge peak forward Figure 10. Relative variation of thermal
current versus overload duration
impedance junction to ambient
(maximum values) (STmite flat)
versus pulse duration (SMA)
18 IM(A)
16
14
12
10
8
6
4 IM
2
0
1.E-04
t
δ = 0.5
1.E-03
t(s)
1.E-02
STmite flat
Tc = 25 °C
Tc = 75 °C
Tc = 125 °C
1.E-01
1.E+00
1.0 Zth(j-a)/Rth(j-a)
0.9 Epoxy printed circuit board,
copper thickness = 35 µm,
0.8 recommended pad layout
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02
1.E-01
1.E+00
1.E+01
SMA
1.E+02
tp(s)
1.E+03
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
1.0 Zth(j-a)/Rth(j-a)
0.9 Epoxy printed circuit board,
copper thickness = 35 µm,
0.8 recommended pad layout
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-02
1.E-01
1.E+00
1.E+01
DO-41
1.E+02
tp(s)
1.E+03
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (STmite flat)
Zth(j-a)/Rth(j-a)
1.0
0.9 Epoxy printed circuit board,
copper thickness = 35 µm,
0.8 recommended pad layout
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-02
1.E-01
1.E+00
1.E+01
STmite flat
1.E+02
tp(s)
1.E+03
4/10
Doc ID 7504 Rev 8
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